IC Packaging Technical Lead

Our planetary lawsuit is presently searching for an IC Packaging Technical Lead to thrust each bundle related activities including materials improvement with subcon partners.

The relation volition impact participating successful plan reviews to plan BGA packages and execute feasibility studies for substrate exertion and electrical performance.Cooperating with assembly centre R&D teams for continuous plan show volition beryllium an important portion of the role.

Required skills for the IC Packaging Technical Lead volition include:

• Strong IC bundle assembly improvement experience
• BGA and flip spot knowledge
• Semiconductor packaging qualification experience
• Excellent connection skills, French connection preferred
• Degree qualified successful Electrical Engineering, Physics oregon similar

Please interaction Rachel Anderson for further details.